参数项参数值
参数项参数值
PackagingBulk
MaterialCeramic
Diameter-
Length0.472" (12.00mm)
ShapeSquare
TypeHeat Spreader
Width0.472" (12.00mm)
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow-
Thermal Resistance @ Natural-
Fin Height0.394" (10.00mm)
Material Finish-
Moisture Sensitivity LevelNot Applicable