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商品参数
参数项参数值
参数项参数值
PackagingBulk
FeaturesClosed Frame
Mounting TypeThrough Hole
TypePGA, ZIF (ZIP)
Operating Temperature-65°C ~ 125°C
Number of Positions or Pins (Grid)-
TerminationSolder
Housing MaterialPolyphenylene Sulfide (PPS)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBeryllium Copper
Moisture Sensitivity Level1 (Unlimited)