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商品参数
参数项参数值
参数项参数值
PackagingTray
Package / Case1156-BBGA, FCBGA
Speed500MHz, 600MHz, 1.2GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package1156-FCBGA (35x35)
ArchitectureMCU, FPGA
Flash Size-
Moisture Sensitivity Level4 (72 Hours)