参数项参数值
参数项参数值
PackagingTray
Package / Case225-LFBGA
Mounting TypeSurface Mount
Speed300MHz, 400MHz
Operating Temperature-40°C ~ 125°C (TJ)
Core ProcessorARM® Cortex®-R52
Voltage - I/O1.8V, 3.3V
Supplier Device Package225-FBGA (13x13)
Ethernet10/100/1000Mbps (1)
USBUSB 2.0 (1)
Number of Cores/Bus Width1 Core, 32-Bit
Co-Processors/DSPMultimedia; NEON™ SIMD
RAM Controllers-
Graphics AccelerationNo
Display & Interface Controllers-
Security Features-
SATA-
Additional InterfacesCANbus, I2C, SCI, SPI, WDT
Moisture Sensitivity Level3 (168 Hours)